Malaysian Pacific Industries Berhad (3867.KL)

MYR 25.9

(-1.45%)

Market Cap (In MYR)

5.16 Billion

Revenue (In MYR)

2.09 Billion

Net Income (In MYR)

164.39 Million

Avg. Volume

315.94 Thousand

Currency
MYR
Country
Technology
Open
-
Prev. Close
-
Day Range
-
Year Range
23.36-41.02
PE
-
EPS
-
Beta Value
0.978
ISIN
MYL3867OO008
CUSIP
-
CIK
-
Shares
-
Earnings Annoncement
-

Company Profile

Sector
Technology
Industry
Semiconductors
CEO
Mr. Manuel Zarauza Brandulas
Employee Count
-
Website
https://www.mpind.my
Ipo Date
2000-01-03
Details
Malaysian Pacific Industries Berhad, an investment holding company, engages in the manufacture, assemble, test, and sale of integrated circuits, semiconductor devices, electronic components, and lead frames in Asia, the United States, and Europe. It also provides turnkey solutions for leaded and leadless semiconductor packaging and test services; and outsourced semiconductor packaging and testing solutions. Its products are used in the industrial, automotive, and telecommunications sectors. The company was formerly known as Federal Paper Products Sdn Berhad and changed its name to Malaysian Pacific Industries Berhad in May 1983. Malaysian Pacific Industries Berhad was incorporated in 1962 and is based in Ipoh, Malaysia. Malaysian Pacific Industries Berhad is a subsidiary of Hong Leong Manufacturing Group Sdn Bhd.