Xintec Inc. (3374.TWO)

TWD 208.5

(1.21%)

Market Cap (In TWD)

56.57 Billion

Revenue (In TWD)

6.38 Billion

Net Income (In TWD)

1.37 Billion

Avg. Volume

15.03 Million

Currency
TWD
Country
Technology
Open
-
Prev. Close
-
Day Range
-
Year Range
110.5-283.0
PE
-
EPS
-
Beta Value
1.57
ISIN
TW0003374005
CUSIP
-
CIK
-
Shares
-
Earnings Annoncement
-

Company Profile

Sector
Technology
Industry
Semiconductors
CEO
Mr. Chia Hsiang Chen
Employee Count
-
Website
https://www.xintec.com.tw
Ipo Date
2007-12-31
Details
Xintec Inc. operates as a wafer level chip scale packaging company in Asia, the United States, and Europe. The company offers wafer level chip scale packaging for image and environmental sensors; wafer level post passivation interconnection for fingerprint and actuator sensors, micro-electromechanical components, power, analog, and RF components; and wafer testing services. It also provides optical sensor chip scale packaging services comprising side-wall interconnect and through silicon via RDL interconnect products, various glass thickness and filters, and glass bonding to wafer with or without cavity; FSI/BSI/stack wafer reconstruction for mobile, automotive, and consumer applications; and wafer reconstruction with a glass lid for automotive applications. In addition, the company provides micro-electromechanical systems sensor packaging services, such as wafer thinning and bonded wafer partial dicing to reveal bonding pad; CSP, using via last TSV to connect pad on wafer surface toward backside; and dry etching silicon to form large cavities to derive product performance needs; as well as 3D I/O redistribution, power ground enhancement, and dual side connection services. Its products are used in tablets, notebooks, computers, and medical applications. Xintec Inc. was incorporated in 1998 and is headquartered in Taoyuan City, Taiwan.