China Wafer Level CSP Co., Ltd. (603005.SS)

CNY 28.09

(1.78%)

Market Cap (In CNY)

18.31 Billion

Revenue (In CNY)

903.61 Million

Net Income (In CNY)

150.09 Million

Avg. Volume

34.1 Million

Currency
CNY
Country
Technology
Open
-
Prev. Close
-
Day Range
-
Year Range
13.44-36.77
PE
-
EPS
-
Beta Value
0.237
ISIN
CNE100001SM0
CUSIP
-
CIK
-
Shares
-
Earnings Annoncement
-

Company Profile

Sector
Technology
Industry
Semiconductors
CEO
Mr. Wei Wang
Employee Count
-
Website
https://www.wlcsp.com
Ipo Date
2014-02-10
Details
China Wafer Level CSP Co., Ltd. provides wafer level miniaturization technologies and processes for the electronics industry. It offers image sensor, biometric identification, and ambient light sensor chips, as well as medical electronic devices and automotive sensors. The company also provides infrastructure solutions, including design, test, and logistics; design chain management; design for manufacturing; design for cost; full design and verification of WL, leadframe, laminate, etc.; electrical, thermal, and mechanical characterization; and quick turn prototype services. In addition, it offers assembly services, such as turnkey solutions for TSV, wire bond, and flip chip; high-volume manufacturing; wafer finishing and 2/3D assembly; wafer to wafer and die to wafer bonding; micro-joining; integrated and SMT passives; and FA and reliability testing services comprising package and board level, bump reliability, underfill/EMC adhesion, drop and bend tests, solder joint reliability prediction, materials lab, and failure analysis. The company serves consumer, computing, communication, and medical markets. China Wafer Level CSP Co., Ltd. was founded in 2005 and is headquartered in Suzhou, China.