LB Semicon Inc. (061970.KQ)

KRW 3675.0

(-0.81%)

Market Cap (In KRW)

160.9 Billion

Revenue (In KRW)

416.87 Billion

Net Income (In KRW)

-15.18 Billion

Avg. Volume

155.59 Thousand

Currency
KRW
Country
Technology
Open
-
Prev. Close
-
Day Range
-
Year Range
3000.0-9630.0
PE
-
EPS
-
Beta Value
1.133
ISIN
KR7061970000
CUSIP
-
CIK
-
Shares
-
Earnings Annoncement
-

Company Profile

Sector
Technology
Industry
Semiconductors
CEO
Mr. Noh-Man Park
Employee Count
-
Website
https://www.lbsemicon.com
Ipo Date
2011-01-31
Details
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek, South Korea.