Taiwan IC Packaging Corporation (3372.TWO)

TWD 15.0

(0.0%)

Market Cap (In TWD)

2.62 Billion

Revenue (In TWD)

861.69 Million

Net Income (In TWD)

-176.99 Million

Avg. Volume

1.51 Million

Currency
TWD
Country
Technology
Open
-
Prev. Close
-
Day Range
-
Year Range
13.6-26.8
PE
-
EPS
-
Beta Value
0.585
ISIN
TW0003372009
CUSIP
-
CIK
-
Shares
-
Earnings Annoncement
-

Company Profile

Sector
Technology
Industry
Semiconductors
CEO
Chung-Ho Tseng
Employee Count
-
Website
https://www.ticp.com.tw
Ipo Date
2007-12-31
Details
Taiwan IC Packaging Corporation develops optical and ultrathin IC package technologies. The company's products include thin small outline, small outline, SSOP/TSSOP, quad flat no lead/dual flat no lead, thin PKG, TQFP, quad flat, LQFP, thermal enhanced, and image sensor packages. It also offers substrate-based package products, such as LGA, VLGA, micro-SD cards, and SD cards. The company was founded in 1998 and is headquartered in Kaohsiung, Taiwan.